TS-MFK6 Thermal Sheet

• Part Number: TS-MFK6
• Electrically insulating version with Kapton substrate
• Micro-Faze K6 Thermal Interface Material (TIM).
• Temperature range: -45 to 200°C (-49 to 392°F)
• Non silicone based
• Thermal resistance 0.40 °C in²/W @70 psi.
• 6.0 x 6.0 inch sheet
• Just 0.006" (0.152mm) thick before compression.
• Just cut to size with scissors or an X-acto knife.

TS-MFK6 Thermal Sheet

MICRO-FAZE® K is a revolutionary dry-to-touch thermal interface pad formulated with non-silicone thermal grease. It was developed to offer the lowest thermal resistance in a thermal interface without the mess of grease. MICRO-FAZE K is a polyimide insulating substrate coated on both sides with specially formulated thermal grease (non-silicone, non-wax-based) that is naturally tacky but dry to the touch. It offers unique heat transfer and high insulating capabilities, and has a high cut-through resistance.

• Easy to use: Just cut to size with scissors or a knife.
• Will not electrically conduct as the polyimide (Kapton) substrate is electrically insulating.
• Consists of a 2 mil Kapton (polyimide) substrate coated on both sides with a specially formulated thermal compound (non-silicone, non-wax based) that is naturally tacky but dry to the touch.
• MICRO-FAZE K6 retains all the unique advantages of higher thermal performance thermal greases but in the form of a thermal sheet.
• Unlike phase change materials, MICRO-FAZE K6 requires minimum force to achieve total interface contact and heat transfer starts at 25ºC.
• MICRO-FAZE K6 allows for total “wetting action” to fill all microscopic surface voids without changing phase.
• Offers maximum heat transfer capability and electrical isolation for power components.
• Excellent replacement for phase change materials and silicone pads.
• MICRO-FAZE K6 is a “drop-in-place” product for easy handling in a manufacturing environment.
• Thixotropic nature prevents run out.